DocumentCode
3295352
Title
Can a MOSFET survive from multiple breakdowns?
Author
Li, X. ; Tung, C.H. ; Pey, K.L.
Author_Institution
Microelectron. Center, Nanyang Technol. Univ., Singapore, Singapore
fYear
2009
fDate
6-10 July 2009
Firstpage
153
Lastpage
157
Abstract
How can a metal-oxide-semiconductor (MOS) transistor suffer from multiple dielectric breakdowns (BD) with severe structural damages (e.g., local melting and metal migration) remain functional? Our results show that the amorphization of Si in the vicinity of the BD forms an effective p-n diode which prevents terminal short from happening when reverse-biased.
Keywords
MOSFET; semiconductor device breakdown; MOSFET; dielectric breakdowns; Electric breakdown; MOSFET circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2009. IPFA 2009. 16th IEEE International Symposium on the
Conference_Location
Suzhou, Jiangsu
ISSN
1946-1542
Print_ISBN
978-1-4244-3911-9
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2009.5232677
Filename
5232677
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