DocumentCode
3296388
Title
The Impact of Leakage to the Power Supply Impedance of a Microprocessor
Author
Sarangi, Ananda ; Taylor, Greg
Author_Institution
Intel Corp., Hillsboro, OR
fYear
2006
fDate
9-12 May 2006
Firstpage
43
Lastpage
46
Abstract
This paper shows that the resonant behavior of a microprocessor´s power supply is strongly influenced by both the leakage and the dynamic power of the microprocessor. As a result of this, the peak package power supply impedance is a function of the operating conditions of the microprocessor. Measurements on a 65 nm Intelreg Pentiumreg 4 microprocessor have been used to quantify this behavior
Keywords
electronics packaging; microprocessor chips; power supplies to apparatus; leakage impact; microprocessor; peak package power supply impedance; Capacitance; Capacitors; Damping; Frequency; Impedance; Microprocessors; Packaging; Power supplies; Resonance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location
Berlin, Germany
Print_ISBN
1-4244-0455-x
Electronic_ISBN
1-4244-0455-x
Type
conf
DOI
10.1109/SPI.2006.289184
Filename
4069399
Link To Document