• DocumentCode
    3296503
  • Title

    Fatigue of soft-soldered contacts at surface-mounted devices

  • Author

    Hieber, Hartmann

  • Author_Institution
    Philips GmbH Forschungslab., Hamburg, West Germany
  • fYear
    1988
  • fDate
    12-14 Apr 1988
  • Firstpage
    234
  • Lastpage
    238
  • Abstract
    An attempt is made to show the partially reversible flow mechanics of soft-soldered contacts. It is pointed out that the localization of irreversible strain makes a prediction of failure during thermomechanical fatigue tests difficult. Viscoelastic flow of SnPb40 solder is discussed, along with the microstructure of soft-soldered contacts
  • Keywords
    failure analysis; fatigue testing; lead alloys; soldering; surface mount technology; thermal stress cracking; tin alloys; viscoelasticity; SnPb40 solder; failure prediction; irreversible strain localisation; microstructure; partially reversible flow mechanics; soft-soldered contacts; surface-mounted devices; thermomechanical fatigue tests; viscoelastic flow; Capacitive sensors; Creep; Elasticity; Fatigue; Microstructure; Plastics; Strain measurement; Temperature; Tensile stress; Testing; Thermal stresses; Thermomechanical processes; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium 1988. 26th Annual Proceedings., International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/RELPHY.1988.23456
  • Filename
    23456
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3296503