Title :
SPI Proceedings: Analysis of High-Speed Digital Interfaces in Flexible Interconnections
Author :
Kotiranta, Pia ; Kelander, Llkka ; Rouvala, Markku
Author_Institution :
Nokia Research Center, Itÿmerenkatu 11-13, FIN-00045 Nokia Group, E-mail: pia.kotiranta@nokia.com
Abstract :
For mobile device applications, the performance of data interconnections has been getting into focus only lately. Requirements for higher performance devices and product miniaturization have been challenging the design of high-speed interconnections, driving the accurate and fast modeling of interconnect circuits. Here the maximum usable data rate analysis of a high-speed serial, camera- and display-like interface on a specific interconnection template is presented. Multiple modelling methods are combined to construct a flexible interconnection concept with various components. The effect of coupled antenna interference on the interconnection signal quality is included in the study.
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
DOI :
10.1109/SPI.2006.289230