Title :
Modeling and Simulation of Highly Inductive On-Chip Interconnects
Author :
Ligocka, A. ; Bandurski, W.
Author_Institution :
Poznan Univ. of Technol.
Abstract :
In the paper we present our approach to estimation of the transmission line step response. The main idea of the presented approach is to approximate the output signal of the lossy line, by analysis the behavior of the lossless transmission line. The output signal is expanded in the series of traveling waves. We construct the conditions when the first incident wave of lossless line is good approximation of the step response of the line
Keywords :
VLSI; integrated circuit interconnections; transmission line theory; VLSI; highly inductive on-chip interconnects; lossless transmission line; lossy line; transmission line step response; traveling waves; Circuit simulation; Inductance; Integrated circuit interconnections; Laplace equations; Propagation losses; RLC circuits; Transmission line theory; Transmission lines; Very large scale integration; Voltage;
Conference_Titel :
Signal Propagation on Interconnects, 2006. IEEE Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
1-4244-0455-x
Electronic_ISBN :
1-4244-0455-x
DOI :
10.1109/SPI.2006.289231
