Investigation of thermal interface material on system-level light-emitting diode

Generally, the effect of thermal interface material on thermal behavior of system-level light-emitting diode was presented. Application of thermal tape and thermal paste were selected to be applied on the contacting surfaces between package and heat sink. Thermal Transient Tester and T3Ster-Master software were adopted for thermal transient recording and evaluation. From the studies, it was observed that the selection of thermal interface material had a great impact on thermal management of light-emitting diode. Employing thermal paste as boundary condition revealed a reduction of about 6% in junction to ambient thermal resistance compared to thermal tape. In this paper, the thermal responses of the light-emitting diode with corresponding boundary conditions have been clearly discussed in terms of materials properties such as thermal conductivity, thickness and viscosity of the selected thermal interface materials.