Title :
Monolithic electronic nose system fabricated by post CMOS micromachining
Author :
Cho, Seong M. ; Ko, Sang Choon ; Ha, Seung-Chul ; Kim, Yong Shin ; Kim, Young Jun ; Yang, Yoonseok ; Pyo, Hyeon-Bong ; Choi, Chang Auck
Author_Institution :
Basic Res. Lab., Electron. & Telecommun. Res. Inst., Daejeon
fDate :
Oct. 30 2005-Nov. 3 2005
Abstract :
A monolithic electronic nose system, which has 12 independent channels, was fabricated by post CMOS micromachining process. Read-out integrated circuits were fabricated with the standard CMOS processes with design rule of 0.8 mum. And, the MEMS parts of the electronic nose were fabricated by hybrid etching, composed of bulk micromachining with TMAH (tetramethy lammonium hydroxide) and deep dry etching, on the backside of the wafer after the CMOS processes. Resistance matching circuit, instrumentation amplifier, multiplexer, and transducer circuits with bridge structure were included in the read-out circuitry. And, heat control circuits were also implanted in the monolithic circuit to maintain the temperature of the MEMS sensing parts as constant. Carbon black-polymer composites and Au nano-particles were used as sensor materials. The MEMS parts of the electronic nose were designed to have well-shaped structures. These structures are considered to be suitable for drop coating procedure
Keywords :
CMOS integrated circuits; composite materials; electronic noses; etching; gold; micromachining; micromechanical devices; polymers; 0.8 micron; Au; MEMS; TMAH; bulk micromachining; carbon black-polymer composites; deep dry etching; heat control circuits; hybrid etching; instrumentation amplifier; monolithic circuit; monolithic electronic nose system; multiplexer circuits; post CMOS micromachining; read-out integrated circuits; resistance matching circuit; sensor materials; tetramethy lammonium hydroxide; transducer circuits; CMOS integrated circuits; CMOS process; Dry etching; Electronic noses; Instruments; Micromachining; Micromechanical devices; Multiplexing; Process design; Transducers;
Conference_Titel :
Sensors, 2005 IEEE
Conference_Location :
Irvine, CA
Print_ISBN :
0-7803-9056-3
DOI :
10.1109/ICSENS.2005.1597725