DocumentCode :
3303143
Title :
Development of Next Generation Environment-Friendly Soldering Technology
Author :
Serizawa, Koji ; Okamoto, Masahide ; Ishihara, Shosaku ; Harada, Masahide
Author_Institution :
Production Eng. Res. Lab., Hitachi Ltd., Yokohama, Japan
fYear :
2003
fDate :
8-11 Dec. 2003
Firstpage :
817
Lastpage :
820
Abstract :
The IMS project "Next Generation Environment-Friendly Soldering Technology" has been advanced with the aim of worldwide promotion of Pb-free soldering since fiscal year 2000. The objective of this project is to evaluate the impact of metals used in Pb-free solders on the human body and the environmental impact of the full life cycle of products using Pb-free solders, and also to advance production and recycle (reuse) technologies. In this report, the outline of the project and some results up to fiscal year 2002 are reported.
Keywords :
contamination; environmental degradation; environmental factors; environmental testing; soldering; solders; Next Generation Environment-Friendly Soldering Technology; Pb-free soldering; human body; recycle technologies; Environmental factors; Environmental testing; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Environmentally Conscious Design and Inverse Manufacturing, 2003. EcoDesign '03. 2003 3rd International Symposium on
Conference_Location :
Tokyo, Japan
Print_ISBN :
0-7803-8590-x
Type :
conf
DOI :
10.1109/ECODIM.2003.1322779
Filename :
1322779
Link To Document :
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