DocumentCode
330604
Title
Silicon Micromachining
Author
Esashi, Masayoshi
Author_Institution
Tohoku University
fYear
1998
fDate
13-16 July 1998
Firstpage
3
Lastpage
4
Abstract
Advanced micro sensors for pressure, angular rate, ultrasonic imaging and atomic force have been realized based on silicon bulk-micromachining. Novel techniques as deep RIE, isotropic XeF2 silicon etching performs precise micromachining. Par(alle1 electrode structures enable capacitive sensing and electrostatic actuation for force balancing servo and resonance. 2. Pressure sensor and resonant gyro fabricated using deep RIE and XeF2 etching.
Keywords
Atomic force microscopy; Electrodes; Electrostatic measurements; Etching; Force sensors; Micromachining; Probes; Resonance; Silicon; Slurries;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 1998 International
Conference_Location
Kyoungju, South Korea
Print_ISBN
4-930813-83-2
Type
conf
DOI
10.1109/IMNC.1998.729908
Filename
729908
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