• DocumentCode
    330802
  • Title

    Further improving heat dissipation from large aluminum electrolytic capacitors

  • Author

    Stevens, J.L. ; Sauer, J.D. ; Shaffer, J.S.

  • Author_Institution
    Philips Components, Columbia, SC, USA
  • Volume
    2
  • fYear
    1998
  • fDate
    12-15 Oct. 1998
  • Firstpage
    1125
  • Abstract
    In prior studies we have reported considerable progress in improving the heat dissipation due to ripple current for large aluminum electrolytic capacitors [elcaps]. Due to these enhanced thermal construction techniques, elcaps are now commercially available with very high ripple current ratings at moderate cost. In those same studies, some effort was devoted to the improvement of the heat dissipation from the elcap into the external environment. This paper extends that work. A number of attempts have been made to enhance the removal of heat from the exterior of large elcaps with varying degrees of acceptance. We describe several approaches to external heat removal including an active heat removal system, which can deliver total thermal resistances around 1 C/Watt with a minimum of additional required space. It is believed that these approaches will be useful to those equipment designers who place a high priority on achieving the greatest possible circuit densities without resorting to liquid cooling.
  • Keywords
    aluminium; cooling; electrolytic capacitors; thermal resistance; Al; active heat removal system; circuit densities; enhanced thermal construction techniques; heat dissipation improvement; large aluminum electrolytic capacitors; ripple current; total thermal resistances; Aluminum; Capacitors; Circuits; Costs; Packaging; Resistance heating; Space heating; Surface resistance; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 1998. Thirty-Third IAS Annual Meeting. The 1998 IEEE
  • Conference_Location
    St. Louis, MO, USA
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-4943-1
  • Type

    conf

  • DOI
    10.1109/IAS.1998.730288
  • Filename
    730288