DocumentCode
3311701
Title
A three-phase line flow calculation approach for distribution automation
Author
Wei-Tzer Huang ; Kai-Chao Yao ; Chun-Ching Wu
Author_Institution
Dept. of Ind. Educ. & Technol., Nat. Changhua Univ. of Educ., Changhua, Taiwan
fYear
2013
fDate
4-7 Aug. 2013
Firstpage
599
Lastpage
604
Abstract
A fast and high-efficient sensitivity-based approach for real-time three-phase line flow calculation is proposed in this paper, this approach combines the three-phase power-flow (TPPF) solution techniques with the new sensitivity factor, named three-phase ZBUS distribution factor (TPZBD). The TPZBD is associated with both the changes of real and reactive power injections of individual phase at each bus into the three-phase line flow. Hence, the proposed TPZBD directly reflects load demand changes to the line flow. Accordingly, any feasible TPPF solution technique must be used to solve for the base case line flow solution at first time, based on the solution and TPZBD formulas, the real-time three-phase line flow is determined rapidly by the presented approach without any iteration after load demand changes. Finally, a 7-node sample system that is modified from Taipower distribution feeders is used to test the proposed approach. The results of this paper demonstrate that the proposed approach is capable of calculating real-time three-phase line flow for distribution automation.
Keywords
power distribution lines; power engineering computing; TPPF solution techniques; TPZBD; Taipower distribution feeders; distribution automation; sensitivity factor; sensitivity-based approach; three-phase ZBUS distribution factor; three-phase line flow calculation approach; three-phase power-flow solution techniques; Impedance; Load flow; Mathematical model; Reactive power; Real-time systems; Sensitivity; Silicon; Distribution Systems; Line Flow Calculation; Sensitivity Factors; TPZBD; Three-phase Power-Flow; ZBUS Impedance Matrix;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2013 IEEE International Conference on
Conference_Location
Takamatsu
Print_ISBN
978-1-4673-5557-5
Type
conf
DOI
10.1109/ICMA.2013.6617984
Filename
6617984
Link To Document