• DocumentCode
    3313433
  • Title

    From system level to defect-oriented test: a case study

  • Author

    Dias, O.P. ; Semião, J. ; Santos, M.B. ; Teixeira, I.M. ; Teixeira, J.P.

  • Author_Institution
    Escola Superior de Tecnologia, INESC, Portugal
  • fYear
    1999
  • fDate
    25-28 May 1999
  • Firstpage
    136
  • Lastpage
    141
  • Abstract
    The purpose of this paper is to demonstrate the usefulness of a recently proposed Object-Oriented (OO) based methodology and tools (SysObj and Test-Adder) when applied in the design of testable hardware modules (eventually used as embedded cores in SOCs). A public domain processor (PIG) is the vehicle for such assessment. A boundary scan soft wrapper design is presented and architectural quality is evaluated by adequate metrics. A novel mixed-level, defect-oriented fault simulator, VeriDOS, is used to demonstrate the efficiency of applying a functional lest (stored in the ROM) after the structural test (using built-in scan) to detect a significant number of physical defects not covered by the LSA test set. This illustrates how system-level test can be reused to enhance the quality of a production test.
  • Keywords
    automatic testing; boundary scan testing; design for testability; electronic equipment testing; embedded systems; fault simulation; object-oriented methods; production testing; Object-Oriented method; SysObj; VeriDOS; boundary scan soft wrapper design; built-in scan; defect-oriented test; efficiency; embedded cores; functional lest; mixed-level fault simulator; physical defects; production test; public domain processor; quality; structural test; system level; testable hardware modules; Computer aided software engineering; Electronic equipment testing; Fault detection; Hardware; Logic testing; Object oriented modeling; Read only memory; Software testing; System testing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    European Test Workshop 1999. Proceedings
  • Conference_Location
    Constance, Germany
  • Print_ISBN
    0-7695-0390-X
  • Type

    conf

  • DOI
    10.1109/ETW.1999.804509
  • Filename
    804509