• DocumentCode
    331558
  • Title

    Preliminary evaluation of CR Kapton(R) backed mica paper tape for high voltage coil groundwall insulation using vacuum-pressure-impregnation

  • Author

    Emery, F.T.

  • Author_Institution
    Westinghouse Power Generation, Orlando, FL, USA
  • Volume
    1
  • fYear
    1998
  • fDate
    25-28 Oct 1998
  • Firstpage
    227
  • Abstract
    Of interest, is to find a mica paper tape with higher dielectric properties than commercially available tapes. This paper presents the results of a preliminary evaluation of Corona Resistant (CR) Kapton(R) backed mica paper tape. These tapes were evaluated for possible use for high voltage coil groundwall insulation using vacuum-pressure-impregnation (VPI) with epoxy resins. CR Kapton(R) Mica Paper tape was used to insulate 3 aluminum test bars and impregnated with epoxy resin using a VPI process. The impregnating resin and process is used in the fabrication and processing of high voltage stator coils usually insulated with glass backed mica paper tape. An evaluation of the insulated test bars was done and the results are compared to other commercially available glass backed mica paper taped test bars; processed and evaluated under identical conditions. This paper reviews the results of the evaluation of CR Kapton(R) tape; showing good dielectric properties which could make it suitable for use in high voltage coil insulation
  • Keywords
    coils; impregnated insulation; mica; paper; polymer films; stators; CR Kapton backed mica paper tape; Corona Resistant Kapton; dielectric properties; epoxy resin; high voltage coil groundwall insulation; stator coil; vacuum pressure impregnation; Aluminum; Bars; Chromium; Coils; Corona; Dielectrics and electrical insulation; Epoxy resins; Glass; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1998. Annual Report. Conference on
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-5035-9
  • Type

    conf

  • DOI
    10.1109/CEIDP.1998.733934
  • Filename
    733934