Application of holography to evaluate the thermal deformation of printed circuit board connector due to thermal stress

Author

Taniguchi, Masanari ; Takagi, Tasuku

Author_Institution

Fac. of Sci. & Technol., Meijo Univ., Nagoya, Japan

fYear

1999

fDate

1999

Firstpage

276

Lastpage

281

Abstract

The contact resistances of thermally stressed PCB connector contacts were measured. The holographic interferometry measuring system (HIMS) was applied to analyze the thermal deformation of the PCB connector due to current flow. As a result, we found some contact failure, and the HIMS was shown to be a very effective tool to measure the microscopic deformation pattern. In this paper, an experimental condition for application of thermal stress, the HIMS and the experimental results were introduced along with some suggestions for choosing high current contacts in a connector from the thermal deformation viewpoint

Keywords

contact resistance; deformation; electric connectors; holographic interferometry; printed circuit accessories; printed circuit testing; thermal stresses; HIMS; PCB connector; contact resistance; current flow; high current contacts; holographic interferometry measuring system; holography; microscopic deformation pattern; printed circuit board connector; thermal deformation; thermal deformation analysis; thermal stress; thermally stressed PCB connector contacts; Connectors; Contacts; Current measurement; Electrical resistance measurement; Health information management; Holography; Interferometry; Stress measurement; Thermal resistance; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1999. Twenty-Fourth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-5502-4

Type

conf

DOI

10.1109/IEMT.1999.804833

Filename

804833