Title :
3D stacked Si CMOS VLSI smart pixels using through-Si optoelectronic interconnections
Author :
Bond, S.W. ; Jung, S. ; Vendier, O. ; Brooke, M.A. ; Jokerst, N.M.
Author_Institution :
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We have presented the first demonstration of an optically interconnected three dimensional smart pixel system connecting three stacked layers of Si CMOS VLSI circuitry. We have demonstrated vertical optical communication between three CMOS circuit layers with operation speeds up to 1 Mbps. This system demonstrates the viability of implementing optical interconnections for scalable 3D interconnection systems for ultra-smart pixel applications.
Keywords :
CMOS integrated circuits; VLSI; digital signal processing chips; integrated optoelectronics; optical interconnections; silicon; smart pixels; 3D optically interconnected smart pixel system; 3D stacked Si CIMOS VLSI smart pixels; CMOS circuit layers; Si; Si CMOS VLSI circuitry; operation speeds; optical interconnections; scalable 3D interconnection systems; stacked layers; through-Si optoelectronic interconnections; ultra-smart pixel applications; vertical optical communication; CMOS process; Integrated circuit interconnections; Optical films; Optical interconnections; Optical receivers; Optical signal processing; Optical transmitters; Smart pixels; Stimulated emission; Very large scale integration;
Conference_Titel :
Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-4953-9
DOI :
10.1109/LEOSST.1998.690406
