Title :
Flip chip bonders for high end optoelectronic modules
Author_Institution :
Karl Suss America Inc., Waterbury Center, VT, USA
Abstract :
A new flip chip bonder for very high accuracy assembly of optoelectronic devices is described. Attention will be focussed on mechanical and thermal design and performance issues, with bonding results from a laser diode device
Keywords :
chip scale packaging; flip-chip devices; integrated circuit bonding; integrated optoelectronics; soldering; flip chip bonders; high end optoelectronic modules; laser diode device; mechanical design; passive alignment; performance; solder assembly; thermal design; very high accuracy assembly; Assembly; Bonding; Costs; Data communication; Diode lasers; Flip chip; Optical design; Optoelectronic devices; Passive optical networks; Temperature;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4947-4
DOI :
10.1109/LEOS.1998.737751
