Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links

Author

Koelle, U. ; Johnson, S.R. ; Kelkar, P. ; Turpin, R. ; Dowd, P. ; Pan, G. ; Zhang, Y-H

Author_Institution

Center for Solid State Electron. Res., Arizona State Univ., Tempe, AZ, USA

Volume

1

fYear

1998

fDate

1-4 Dec 1998

Firstpage

166

Abstract

Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs

Keywords

CMOS digital integrated circuits; data communication; driver circuits; flip-chip devices; integrated optoelectronics; optical interconnections; quantum well lasers; semiconductor laser arrays; silicon; surface emitting lasers; 8x8 VCSEL array flip-chip; Al metal lines; Si; VCSEL arrays; bonded devices; contact pads; dummy silicon chip; flip-chip bonding; high speed Si-based CMOS driver ICs; high speed data links; power output; real CMOS driver IC; reliably; silicon driver chips; threshold current; Bonding; Data communication; Driver circuits; Gallium arsenide; Integrated circuit interconnections; Optical devices; Optical interconnections; Silicon; Threshold current; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE

Conference_Location

Orlando, FL

Print_ISBN

0-7803-4947-4

Type

conf

DOI

10.1109/LEOS.1998.737783

Filename

737783