Flip-chip for millimeter-wave and broadband packaging

Emerging markets for mm-wave wireless and sensor systems as well as high bit-rate components demand for cost-effective packaging solutions. Flip-chip is one of the most promising approaches in this regard combining high-volume potential with excellent high-frequency performance. The talk presents the different flip-chip concepts in use, focusing on the microwave characteristics and approaching the subject from the designer´s point of view. Basic electromagnetic properties of the interconnects as well as consequences for chip and package design are discussed. As carrier substrates, conventional ceramics, thin-film, and LTCC-multilayer approaches are covered. Experimental results for various applications document feasibility and capabilities in the frequency range up to 100 GHz.