• DocumentCode
    3319958
  • Title

    New polyimides containing aliphatic segments and thin films based on them

  • Author

    Popovici, D. ; Hulubei, C. ; Musteata, V.E. ; Bruma, M. ; Muller, A.

  • Author_Institution
    Petru Poni Inst. of Macromolecular Chem., Iasi, Romania
  • Volume
    02
  • fYear
    2010
  • fDate
    11-13 Oct. 2010
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    A series of polyimides (PI) based on two dianhydrides, namely 5-(2,5-dioxotetra-hydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylicanhydride (DOCDA) and benzophenonetetracarboxylicdianhydride (BTDA), and an aliphatic diamine, namely 1,6 diaminohexane (DAH), have been obtained by solution polycondensation reaction, followed by thermal ring closure of the resulting polyamic acids. The chemical structures were identified by infrared and 1H-NMR spectroscopy and their thermal and electrical properties (dielectric constant and dielectric loss at different frequencies) were investigated. The polymers showed good thermal stability, with no significant weight loss up to 340°C, with 5% weight loss temperature in the range of 345-430°C and glass transition temperatures (Tgs) between 122-190°C. The resulting polyimides gave flexible films by thermal imdization of poly (amic acid) precursors. The AFM analysis revealed a smooth topography of their surfaces, with root-mean-square (Sq) roughness between 0.42-6.32 nm and average roughness (Sa) in the range of 0.33-2.39 nm. The dielectric constants of the PI films varied between 3.05 and 2.68 at 1 MHz frequency. The correlation between the polymers structure and their properties has been discussed.
  • Keywords
    dielectric losses; glass transition; infrared spectra; nuclear magnetic resonance; permittivity; polymer films; polymer structure; polymerisation; surface roughness; thermal stability; 1,6 diaminohexane; 1H-NMR spectroscopy; AFM; aliphatic segments; chemical structures; dianhydrides; dielectric constant; dielectric loss; electrical properties; frequency 1 MHz; glass transition temperatures; infrared spectroscopy; polyimides; root-mean-square roughness; smooth surface topography; solution polycondensation reaction; thermal imdization; thermal properties; thermal ring closure; thermal stability; thin films; weight loss temperature; Dielectric constant; Films; Plastics; Polyimides; Temperature measurement; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference (CAS), 2010 International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4244-5783-0
  • Type

    conf

  • DOI
    10.1109/SMICND.2010.5650689
  • Filename
    5650689