Title :
Post-weld-shift in butterfly package
Author :
Huang, W.K. ; Hsu, Y.C. ; Sheen, M.T. ; Cheng, W.H.
Author_Institution :
Inst. of Electro-Opt. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
We present a novel image acquisition system to measure the post-weld-shift (PWS) in the butterfly package of a laser diode module. The results show that the measurements of PWS were 1.7 μm and 4.7 μm in the X and Z-axis, respectively. This indicates that the dominant movement of the fiber PWS in a butterfly package is along the Z-axis.
Keywords :
displacement measurement; modules; semiconductor device measurement; semiconductor device packaging; semiconductor lasers; welding; 1.7 micron; 4.7 micron; PWS measurement; X-axis movement; Z-axis movement; butterfly package post-weld-shift; image acquisition system; laser diode module; optical fiber shift; Diode lasers; Electronic packaging thermal management; Fiber lasers; Optical materials; Optical transmitters; Packaging machines; Semiconductor device packaging; Thermal conductivity; Welding; Workstations;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188816
