DocumentCode
3322210
Title
Using TCAD for fast analysis of misprocessed wafers and yield excursions
Author
Minixhofer, Rainer ; Rathei, Dieter
Author_Institution
Austriamicrosystems AG
fYear
2005
fDate
11-12 April 2005
Firstpage
197
Lastpage
199
Abstract
So far, TCAD simulation has been extensively used for process development, but its application for manufacturing control and corrective action was very limited. In this paper we show that TCAD can also be very beneficially used for identifying manufacturing accidents like missing or doubled implants without involving process integration or device physics experts
Keywords
integrated circuit manufacture; manufacturing processes; production engineering computing; technology CAD (electronics); TCAD; corrective action; doubled implants; manufacturing accident identification; manufacturing control; misprocessed wafer analysis; missing implants; process development; yield excursion analysis; Accidents; Computational modeling; Data engineering; Fabrication; Implants; Manufacturing processes; Production; Semiconductor device testing; Semiconductor devices; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location
Munich
Print_ISBN
0-7803-8997-2
Type
conf
DOI
10.1109/ASMC.2005.1438794
Filename
1438794
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