DocumentCode
332265
Title
What´s new in curriculum design: working with industry
Author
Lidtke, D.K.
Author_Institution
Dept. of Comput. & Inf. Sci., Towson Univ., Baltimore, MD, USA
Volume
2
fYear
1998
fDate
4-7 Nov. 1998
Abstract
Summary form only given. The process of curriculum design in computing sciences has changed little in the last three decades, while the content of computing curricula has changed continuously because of the technology upon which it is based and the explosive growth of knowledge in the field. However, developments in computing have changed the process that is being used by a number of groups in curriculum development, specifically, curricula are being developed by groups of individuals representing both academia and industry. This change is evidenced in several projects funded by the National Science Foundation. This involvement of industry may enliven the learning environment and increase student motivation to learn. Industry has developed a greater involvement in colleges and universities. The trend toward outcomes based assessment has frequently resulted in an active Industry Advisory Board or a survey of industry to evaluate the recent graduates they have hired. The recent shortage of IT workers has forced industry to recruit regularly on college campuses and to take a greater interest in the preparation of students in the computing sciences.
Keywords
computer science education; educational courses; National Science Foundation; active Industry Advisory Board; computing curricula content; computing sciences; curriculum design; industry; learning environment; student motivation; student preparation; Collaborative work; Computer Society; Computer industry; Curriculum development; Educational institutions; Explosives; Industrial relations; Machinery; Management information systems; Process design;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education Conference, 1998. FIE '98. 28th Annual
Conference_Location
Tempe, AZ, USA
ISSN
0190-5848
Print_ISBN
0-7803-4762-5
Type
conf
DOI
10.1109/FIE.1998.738885
Filename
738885
Link To Document