FODEL(R) photoimageable technology in microwave applications

Author

Dziurdzia, Barbara ; Nowak, Stanislaw

Author_Institution

Res. & Dev. Centre for Hybrid Microelectron. & Resistors, Krakow, Poland

Volume

2

fYear

1998

fDate

20-22 May 1998

Firstpage

445

Abstract

New circuit technologies capable of delivering high volume production, low cost microwave hybrids are still being sought. Advanced thick film technology offers new solutions suitable for microwave performance: the etching of fired thick films and the photoimaging of photosensitive thick films. Both techniques, using novel thick film materials and photopatterning gives a performance comparable with thin film techniques at significantly lower cost

Keywords

UHF integrated circuits; etching; hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; microwave integrated circuits; photolithography; thick film circuits; FODEL photoimageable technology; advanced thick film technology; etching; fired thick films; high volume production; hybrid MICs; low cost microwave hybrids; microwave applications; photoimaging; photopatterning; photosensitive thick films; Conducting materials; Costs; Dielectric substrates; Etching; Gold; Microwave technology; Space technology; Thick film circuits; Thick films; Thin film circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves and Radar, 1998. MIKON '98., 12th International Conference on

Conference_Location

Krakow

Print_ISBN

83-906662-0-0

Type

conf

DOI

10.1109/MIKON.1998.740821

Filename

740821