DocumentCode
3327313
Title
Low-cost lead-free solder for EE industries
Author
Thanachayanont, C. ; Ramungul, N.
Author_Institution
Nat. Metal & Mater. Technol. Center, Pathumthani, Thailand
Volume
2
fYear
2002
fDate
11-14 Dec. 2002
Firstpage
1213
Abstract
Recently, there has been an increasing awareness of restrictions of lead usage in electrical and electronic equipments. In this paper, materials proposed to replace SnPb solder were reviewed. This includes details of phase diagrams of chosen binary and ternary material systems, relevant microstructures and, hence, mechanical properties. Although, SnAgCu alloy seems to be the most appropriate replacement for SnPb alloy, in terms of cost, SnCu seems to be a better candidate.
Keywords
alloys; electrical engineering; electronic engineering; metallurgy; soldering; EE industries; lead usage; lead-free solder; mechanical properties; microstructures; phase diagrams; Bismuth; Companies; Costs; Electrical equipment industry; Electronic equipment; Environmentally friendly manufacturing techniques; Hazardous materials; Lead; Legislation; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2002. IEEE ICIT '02. 2002 IEEE International Conference on
Print_ISBN
0-7803-7657-9
Type
conf
DOI
10.1109/ICIT.2002.1189347
Filename
1189347
Link To Document