DocumentCode :
3327390
Title :
A novel process of achieving sub-micron gate holes for high-frequency operation of field emitter arrays
Author :
Uhm, H.S. ; Lee, J.H. ; Song, Y.H. ; Cho, Y.R. ; Whang, C.S. ; Kim, D.H. ; Cho, K.I. ; Park, C.K. ; Park, J.S.
Author_Institution :
Dept. of Electr. Eng., Hanyang Univ., Kyonggi, South Korea
fYear :
2001
fDate :
2001
Firstpage :
151
Lastpage :
152
Abstract :
A novel process to develop field emitter arrays (FEAs) with sub-micron gate holes for high-frequency (GHz) operation of FEA-based microtriode amplifiers is proposed. The formation of amorphous silicon (a-Si) sidewall may be the key technology used to obtain the emitter structure. Scanning electron microscope (SEM) images, field-emission properties, transconductances, and capacitances of the emitters fabricated are presented. Theoretical considerations on the proposed structure are also discussed
Keywords :
electron field emission; microwave amplifiers; microwave tubes; scanning electron microscopy; triodes; vacuum microelectronics; Si; amorphous silicon sidewall; capacitance; field emission; field emitter array; high-frequency operation; microtriode amplifier; scanning electron microscopy; sub-micron gate holes; transconductance; Capacitance; Cathodes; Cutoff frequency; Dielectrics; Electrodes; Etching; Field emitter arrays; Microwave devices; Operational amplifiers; Scanning electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Microelectronics Conference, 2001. IVMC 2001. Proceedings of the 14th International
Conference_Location :
Davis, CA
Print_ISBN :
0-7803-7197-6
Type :
conf
DOI :
10.1109/IVMC.2001.939698
Filename :
939698
Link To Document :
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