• DocumentCode
    3328097
  • Title

    An experimental investigation of 4-layer printed circuit board decoupling

  • Author

    Hubing, T. ; Van Doren, T. ; Sha, F. ; Drewniak, J. ; Wilhelm, M.

  • Author_Institution
    Electromagnetic Compatibility Lab., Missouri Univ., Rolla, MO, USA
  • fYear
    195
  • fDate
    14-18 Aug 195
  • Firstpage
    308
  • Lastpage
    312
  • Abstract
    This paper examines the measured power bus impedance of fully populated 4-layer printed circuit boards with internal power and ground planes. Three boards provided by two leading computer companies were evaluated. Each of the state-of-the-art high-speed boards used in this study employed surface-mount decoupling capacitors to reduce noise on the power bus. The boards were measured with and without some or all of their decoupling capacitance. The effectiveness of the decoupling capacitors as a function of location and frequency and the relationship between board impedance and power bus noise was explored. The behavior of 4-layer boards is shown to be quite different than that of boards without planes or boards with closely spaced planes
  • Keywords
    capacitors; electric impedance measurement; electric noise measurement; printed circuit testing; surface mount technology; 4-layer printed circuit board decoupling; experimental investigation; frequency; ground planes; high-speed boards; internal power; location; measured power bus impedance; noise reduction; power bus noise; surface-mount decoupling capacitors; Circuit testing; Distributed parameter circuits; Frequency; Inductance; Noise measurement; Power measurement; Power transmission lines; Printed circuits; Spectral analysis; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-3608-9
  • Type

    conf

  • DOI
    10.1109/ISEMC.1995.523569
  • Filename
    523569