A high throughput test methodology for MCM substrates

Author

Kim, Bruce C. ; Keezer, David ; Chatterjee, Abhijit

Author_Institution

Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA

fYear

1998

fDate

18-23 Oct 1998

Firstpage

234

Lastpage

240

Abstract

This paper describes a new high throughput test methodology for a new multi-chip module (MCM) substrate. This is based on a new MCM substrate technology which contains interconnects, embedded passive devices, and mixed-signal circuits, currently being developed by the Packaging Research Center at Georgia Tech. The resulting MCM modules are called SLIM (single layer integrated module). In this paper a best methodology for SLIM modules is discussed

Keywords

integrated circuit interconnections; integrated circuit testing; multichip modules; substrates; MCM modules; MCM substrates; Packaging Research Center; SLIM substrate; embedded passive devices; high throughput test; interconnects; mixed-signal circuits; multichip module substrate; single layer integrated module; Bonding; Circuit testing; Costs; Impedance; Manufacturing; Packaging; Probes; Radio frequency; Throughput; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1998. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-5093-6

Type

conf

DOI

10.1109/TEST.1998.743157

Filename

743157

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=332815