Expediting ramp-to-volume production

Author

Balachandran, Hari ; Parker, Jason ; Gammie, Gordon ; Olson, John ; Force, Craig ; Butler, Kenneth M. ; Jandhyala, Sri

Author_Institution

M/S 8714, Texas Instrum. Inc., Dallas, TX, USA

fYear

1999

fDate

1999

Firstpage

103

Lastpage

112

Abstract

High levels of integration have complicated the entire IC manufacturing process. Crucial steps such as ramp to volume production and yield improvement techniques are being challenged. In this paper, a diagnostic system that has been developed and deployed into a production environment is presented. Experiments conducted demonstrating the value of the diagnostic tool and its limitations are presented

Keywords

automatic test pattern generation; boundary scan testing; electron beam testing; fault diagnosis; integrated circuit testing; production testing; ATPG; IC manufacturing process; automated diagnosis; boundary scan fail; diagnostic system; electron beam probing; failure site isolation; high levels of integration; internal scan; production environment; ramp to volume production; wafer probe; yield improvement; Design for testability; Image analysis; Instruments; Integrated circuit yield; Manufacturing processes; Packaging; Photonic crystals; Production systems; Semiconductor device manufacture; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1999. Proceedings. International

Conference_Location

Atlantic City, NJ

ISSN

1089-3539

Print_ISBN

0-7803-5753-1

Type

conf

DOI

10.1109/TEST.1999.805619

Filename

805619