• DocumentCode
    3330278
  • Title

    High-frequency interconnect modeling for global signal networks

  • Author

    Gonzalez-Diaz, O. ; Linares-Aranda, M. ; Torres-Torres, R.

  • Author_Institution
    Inst. Nac. de Astrofis., Opt. y Electron. (INAOE), Tonantzintla, Mexico
  • fYear
    2009
  • fDate
    2-5 Aug. 2009
  • Firstpage
    1163
  • Lastpage
    1166
  • Abstract
    In this work, a systematic analysis of the transmission line models used for high-frequency global interconnection lines is presented. As part of this analysis, two model implementations are carried out using: i) the technology parameters provided by the manufacturer, and ii) the scattering (Sij) parameters associated with a transmission line. In order to serve as test vehicles, a chain of inverters and several ring oscillators with lines of width wi = 2 mum and length li = 1.0 to 3.0 mm were implemented using an Austria miscrosystems 0.35 mum process technology and a power supply of 3.3 V. The simulation results using the equivalent model obtained from S-parameters show the lowest average error when they are compared with post layout simulations. In addition, the obtained results show that the total delay in a chain on three inverters is increased up to 120% and the operation frequency of ring oscillator is reduced up to 58.8% when long interconnections (li = 3 mm) are used.
  • Keywords
    S-parameters; equivalent circuits; high-frequency transmission lines; integrated circuit interconnections; integrated circuit modelling; invertors; oscillators; Austria miscrosystem; S-parameters; equivalent model; global signal network; high-frequency interconnect modeling; inverters; ring oscillators; size 0.35 mum; size 1 mm to 3.0 mm; systematic analysis; transmission line model; voltage 3.3 V; Delay; Frequency; Inverters; Power supplies; Power transmission lines; Ring oscillators; Scattering parameters; Testing; Vehicles; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
  • Conference_Location
    Cancun
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-4479-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2009.5235941
  • Filename
    5235941