DocumentCode
3330445
Title
Trends in SLI design and their effect on test
Author
Aitken, Robert ; Muradali, Fidel
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1999
fDate
1999
Firstpage
628
Lastpage
637
Abstract
Trends in System Level Integration (SLI) are analyzed. Based on projections from the SIA roadmap and other sources, the impact of achievable reuse on design and manufacturing cost is projected. Similar analysis suggests that while test execution cost is currently equivalent to design expense in its effect on total production cost, it will dominate in the future. Core testability and its relationship with core `firmness´ is also examined. The implications of these trends on core providers and integrators, standards, tester manufacturers and CAD vendors are investigated
Keywords
automatic testing; design for testability; integrated circuit economics; integrated circuit testing; production testing; CAD; SIA roadmap; System Level Integration; core firmness; core testability; design cost; manufacturing cost; production cost; reuse; test execution cost; Chip scale packaging; Circuit testing; Companies; Computer aided manufacturing; Cost benefit analysis; Design automation; Design methodology; Production; System testing; System-on-a-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1999. Proceedings. International
Conference_Location
Atlantic City, NJ
ISSN
1089-3539
Print_ISBN
0-7803-5753-1
Type
conf
DOI
10.1109/TEST.1999.805787
Filename
805787
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