DocumentCode
3330704
Title
Spatial mapping of actual evapotranspiration and water deficit with MODIS products in the Songnen Plain, northeast China
Author
Zeng, Lihong ; Song, Kaishan ; Zhang, Bai ; Wang, Zongming
Author_Institution
Northeast Inst. of Geogr. & Agric. Ecology, CAS, Changchun, China
fYear
2010
fDate
25-30 July 2010
Firstpage
879
Lastpage
882
Abstract
Analysis of spatial patterns of evapotranspiration (ET) and water deficit (WD) is significant in the evaluation of crop growth status and water use efficiency for the Songnen Plain, an important commodity grain product base of China. Spatial patterns of ET and WD in the Songnen Plain of 2008 growing season (from May to September) were mapped by using MODIS products and meteorological data. The results indicated that ET and WD exhibited obvious spatial variation and gradually increased from southwest to east and northeast. Total ET over the Songnen Plain during the 2008 growing season ranged from 182.7 mm to 1002.4 mm with the mean value of 591.1 mm, and WD ranged from -163.0 mm to 645.9 mm with the mean value of 195.9 mm. Average ET and WD for different land covers varied significantly, water-body and wetlands obtained the highest ET and WD values, while grassland got the lowest ET and WD values. Through this study, it would provide some supports for the assessment of crop growth in arid environments of Songnen Plain.
Keywords
crops; terrain mapping; vegetation mapping; water resources; MODIS products; SEBAL model; Songnen Plain; arid environments; commodity grain product base; crop growth; evapotranspiration; grassland; growing season; land covers; meteorological data; northeast China; spatial mapping; spatial patterns; spatial variation; water deficit; water use efficiency; water-body; wetlands; Agriculture; Estimation; Land surface; MODIS; Remote sensing; Water heating; Water resources; MODIS products; SEBAL model; Songnen Plain; evapotranspiration; water deficit;
fLanguage
English
Publisher
ieee
Conference_Titel
Geoscience and Remote Sensing Symposium (IGARSS), 2010 IEEE International
Conference_Location
Honolulu, HI
ISSN
2153-6996
Print_ISBN
978-1-4244-9565-8
Electronic_ISBN
2153-6996
Type
conf
DOI
10.1109/IGARSS.2010.5651301
Filename
5651301
Link To Document