• DocumentCode
    3330715
  • Title

    EMC and failure mode issues in dielectrics: an update

  • Author

    Sarjeant, W.J. ; Zirnheld, J. ; Burke, K. ; Kohlberg, I. ; Blaise, G.

  • Author_Institution
    Energy Syst. Inst., Buffalo, NY, USA
  • fYear
    2002
  • fDate
    30 June-3 July 2002
  • Firstpage
    621
  • Lastpage
    624
  • Abstract
    Electrical breakdown has been of interest in the areas of energy storage in dielectrics and the aging of capacitors and insulators for a long time. More recently, however, the generation of electromagnetic fields in the external environment by the breakdown process has been receiving attention because of the increased susceptibility of microelectronic components (e.g., VLSI) to unwanted electromagnetic fields. In this presentation Electromagnetic Compatibility (EMC) issues in modem high-density electronics are addressed through a new theory that seeks to explain that sudden energy releases are possible, even in powered-down states of systems, which could create erroneous or misleading internal signals in such systems. This theory introduces the concept of localized stored energy at defects within insulating and semi-insulating materials that make up modem electronics. Experimental validation of these effects, just recently demonstrated, will be presented in the context of this, work in progress.
  • Keywords
    dielectric materials; electric breakdown; electromagnetic compatibility; failure analysis; EMC; VLSI; capacitors ageing; dielectrics; electrical breakdown; electromagnetic compatibility; electromagnetic fields generation; energy storage; insulating materials; insulators ageing; microelectronic components; semi-insulating materials; Aging; Capacitors; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Electromagnetic compatibility; Electromagnetic fields; Energy storage; Microelectronics; Modems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Conference Record of the Twenty-Fifth International
  • ISSN
    1076-8467
  • Print_ISBN
    0-7803-7540-8
  • Type

    conf

  • DOI
    10.1109/MODSYM.2002.1189555
  • Filename
    1189555