Title :
Static Component Interconnection Test Technology (SCITT)
Author :
Hellmold, Steffen
Author_Institution :
Fujitsu Microelectronics, Inc.
Keywords :
Assembly; Chip scale packaging; Circuit faults; Circuit testing; Costs; Fault diagnosis; Integrated circuit interconnections; Logic testing; Microelectronics; Pins;
Conference_Titel :
Test Conference, 1999. Proceedings. International
Print_ISBN :
0-7803-5753-1
DOI :
10.1109/TEST.1999.805872
