• DocumentCode
    3333906
  • Title

    Surface micromachined glass and polysilicon microchannels using MUMPs

  • Author

    Lee, Ki Bang ; Lin, Liwei

  • Author_Institution
    Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
  • fYear
    2003
  • fDate
    19-23 Jan. 2003
  • Firstpage
    578
  • Lastpage
    581
  • Abstract
    MUMPs (Multi-User MEMS Process) based, surface micromachined glass and polysilicon microchannels are fabricated by means of surface micromachining. The prototype glass microchannels are made of a 0.75 μm-thick PSG2 layer on top with cross section of 70 μm in width and 4 μm in height. The polysilicon microchannel are made of a 2 μm-thick poly I layer with a cross section of 7 μm in width and 2 μm in height. Both microchannels have been tested to transport and contain water by means of surface tension force. Because these microchannels are fabricated strictly from the foundry-based micromachining process, they present opportunities for economical prototyping process and provide great potential to be integrated with other micromachined microfluidic systems using foundry-based services for device applications, such as DNA chip and lab-on-a-chip.
  • Keywords
    microfluidics; micromachining; micromechanical devices; phosphosilicate glasses; silicon; 0.75 micron; 2 micron; 4 micron; 7 micron; 70 micron; DNA chip; MUMPs; Multi-User MEMS Process; PSG2 layer; Si; economical prototyping process; foundry-based micromachining process; lab-on-a-chip; micromachined microfluidic systems; polysilicon microchannels; surface micromachined glass microchannels; surface micromachining; surface tension force; DNA; Glass; Lab-on-a-chip; Microchannel; Microfluidics; Micromachining; Micromechanical devices; Prototypes; Surface tension; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7744-3
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2003.1189815
  • Filename
    1189815