• DocumentCode
    3333962
  • Title

    Universal concept for fabricating micron to millimeter sized 3-D parylene structures on rigid and flexible substrates

  • Author

    Feng, Guo-Hua ; Kim, Eun Sok

  • Author_Institution
    Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA, USA
  • fYear
    2003
  • fDate
    19-23 Jan. 2003
  • Firstpage
    594
  • Lastpage
    597
  • Abstract
    This paper describes a novel fabrication concept of using wax as a molding/sacrificial material and conformal parylene deposition to produce large and thin 3D parylene structures on a rigid or flexible substrate such as silicon, metal sheet, paper, fabric, etc. The idea is to form a wax mold for a desired shape, followed by conformal deposition of parylene film over the wax mold, and then to remove the wax in toluene at room temperature to release parylene structures of micron to millimeter size. With this technique, we have fabricated a large area membrane (6 mm in diameter, 2 μm thick) over a curved surface or on a flexible substrate such as a sheet of paper. Also, we have fabricated the following useful devices: (1) parylene bellow tubings on a silicon wafer with microfluidic channels so that the fluidic channels at different levels of the silicon wafer may be connected through the flexible bellow tubings without any leak, and (2) dome-shaped-diaphragm transducers (DSDT) built on a parylene support diaphragm with a piezoelectric film and electrode films.
  • Keywords
    diaphragms; membranes; microfluidics; micromachining; micromechanical devices; moulding; piezoelectric thin films; polymer films; waxes; 2 micron; 3D parylene structures; 6 mm; Si; conformal parylene deposition; curved surface; dome-shaped-diaphragm transducers; electrode films; flexible substrate; flexible substrates; large area membrane; metal sheet; microfabrication; microfluidic channels; paper substrate; parylene bellow tubings; parylene structure release; parylene support diaphragm; piezoelectric film; rigid substrates; silicon wafer; toluene-based wax removal; wax mold; wax mold shape; wax molding material; wax sacrificial material; Bellows; Fabrication; Fabrics; Inorganic materials; Piezoelectric films; Shape; Sheet materials; Silicon; Substrates; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-7744-3
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2003.1189819
  • Filename
    1189819