DocumentCode
3333962
Title
Universal concept for fabricating micron to millimeter sized 3-D parylene structures on rigid and flexible substrates
Author
Feng, Guo-Hua ; Kim, Eun Sok
Author_Institution
Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA, USA
fYear
2003
fDate
19-23 Jan. 2003
Firstpage
594
Lastpage
597
Abstract
This paper describes a novel fabrication concept of using wax as a molding/sacrificial material and conformal parylene deposition to produce large and thin 3D parylene structures on a rigid or flexible substrate such as silicon, metal sheet, paper, fabric, etc. The idea is to form a wax mold for a desired shape, followed by conformal deposition of parylene film over the wax mold, and then to remove the wax in toluene at room temperature to release parylene structures of micron to millimeter size. With this technique, we have fabricated a large area membrane (6 mm in diameter, 2 μm thick) over a curved surface or on a flexible substrate such as a sheet of paper. Also, we have fabricated the following useful devices: (1) parylene bellow tubings on a silicon wafer with microfluidic channels so that the fluidic channels at different levels of the silicon wafer may be connected through the flexible bellow tubings without any leak, and (2) dome-shaped-diaphragm transducers (DSDT) built on a parylene support diaphragm with a piezoelectric film and electrode films.
Keywords
diaphragms; membranes; microfluidics; micromachining; micromechanical devices; moulding; piezoelectric thin films; polymer films; waxes; 2 micron; 3D parylene structures; 6 mm; Si; conformal parylene deposition; curved surface; dome-shaped-diaphragm transducers; electrode films; flexible substrate; flexible substrates; large area membrane; metal sheet; microfabrication; microfluidic channels; paper substrate; parylene bellow tubings; parylene structure release; parylene support diaphragm; piezoelectric film; rigid substrates; silicon wafer; toluene-based wax removal; wax mold; wax mold shape; wax molding material; wax sacrificial material; Bellows; Fabrication; Fabrics; Inorganic materials; Piezoelectric films; Shape; Sheet materials; Silicon; Substrates; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-7744-3
Type
conf
DOI
10.1109/MEMSYS.2003.1189819
Filename
1189819
Link To Document