Title :
CMOS compatible high voltage compliant MESFET based analog IC building blocks
Author :
Kim, Sungho ; Lepkowski, William ; Thornton, Trevor J. ; Bakkaloglu, Bertan
Author_Institution :
Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
Abstract :
MESFET devices provide high breakdown characteristics, enable high voltage operation, and direct battery hook-up with no changes in processing on state of the art SOI and SOS CMOS processes. Fundamental analog building blocks, including single-ended and differential amplifiers and high impedance current mirror were designed and fabricated in a single poly, 3-layer metal digital CMOS technology utilizing fully depletion mode MESFET devices. The measured breakdown voltage of the SOS MESFETS presented here has a breakdown voltage of over 7.5 V without causing irreversible damage. DC characteristics were measured by varying the power supply from 2.5 to 5.5 V. The measured DC transfer curves of amplifiers show good agreement with the simulated ones with extracted models from the same process. The accuracy of the current mirror showing inverse operation is within plusmn5% for the current from 0 to 1.5 mA with the power supply from 2.5 to 5.5 V.
Keywords :
CMOS analogue integrated circuits; CMOS digital integrated circuits; MESFET integrated circuits; silicon-on-insulator; 3-layer metal digital CMOS technology; DC transfer curve; SOI process; SOS CMOS processes; analog IC building block; breakdown voltage; complementary metal oxide semiconductor; current 0 mA to 1.5 mA; differential amplifier; direct battery hook-up; fully depletion mode MESFET devices; high voltage compliant MESFET; single-ended amplifier; voltage 2.5 V to 5.5 V; Analog integrated circuits; Batteries; Breakdown voltage; CMOS analog integrated circuits; CMOS integrated circuits; CMOS technology; MESFET integrated circuits; Mirrors; Power measurement; Power supplies;
Conference_Titel :
Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
Conference_Location :
Cancun
Print_ISBN :
978-1-4244-4479-3
Electronic_ISBN :
1548-3746
DOI :
10.1109/MWSCAS.2009.5236136