• DocumentCode
    333580
  • Title

    EEG dipole tracing

  • Author

    Musha, Toshimitsu ; Okamoto, Yoshiwo

  • Author_Institution
    Brain Functions Lab. Inc., Kawasaki, Japan
  • Volume
    4
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    1683
  • Abstract
    Mathematical processes are described for constructing the SSB head model and estimating the equivalent current dipoles from scalp potentials, which is called the Dipole Tracing (DT) method. The SSB head model is a 3-compartment head model in which uniform electric conductors replace scalp, skull and brain which have different electric conductivities. Accuracy of the estimated dipole locations is calculated in the presence of noise. The electric conductivities of the three shells differ from subject to subject, and conductivity ratios that optimize the SSB head model are determined experimentally by passing electric currents in the head and analyzing the resulting surface potentials. This technique allows more accuracy of the estimated dipole location. Accuracy of the SSB/DT method in a real head was obtained with intracranial subdural electrodes implanted in epileptic patient brains. Finally the physiological meaning of the goodness-of-fit of the dipole approximation of electric activity of the brain cortex is discussed. It is found by computer simulation that it is tightly connected with the degree of impairment of the cortex
  • Keywords
    brain models; electroencephalography; 3-compartment head model; EEG dipole tracing; SSB head model construction; computer simulation; cortex impairment; dipole tracing method; electric conductivities; epileptic patient brains; intracranial subdural electrodes; noise; scalp potentials; shells; skull; uniform electric conductors; Amplitude modulation; Brain modeling; Conductivity; Conductors; Current; Electrodes; Electroencephalography; Mathematical model; Scalp; Skull;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.746908
  • Filename
    746908