• DocumentCode
    333689
  • Title

    Application of 3-D MEG measurement for estimating multiple sources

  • Author

    Uchikawa, Yoshinori ; Kobayashi, Koichiro

  • Author_Institution
    Tokyo Denki Univ., Saitama, Japan
  • Volume
    4
  • fYear
    1998
  • fDate
    29 Oct-1 Nov 1998
  • Firstpage
    2205
  • Abstract
    The authors have developed a three-dimensional (3-D) second-order gradiometer connected to three SQUIDs for vector measurement of MEG that can detect magnetic field components perpendicular and tangential to the scalp simultaneously. Each coil is orthogonally wound with Nb-Ti wire on a rectangular solid 3×3×6 cm. To assess discrimination and separation of multiple sources, the authors carried out both simulation study and 3-D vector measurement of MEG with mixed AEF (auditory evoked field) and SEF (somatosensory evoked field) overlapping in time. The magnetic field distribution perpendicular to the scalp was not helpful for estimating the location and number of sources, owing to the lack of a dipole pattern. But the magnetic field distribution tangential to the scalp can provide information about new constraint conditions by visual inspection. The authors estimated multiple sources of mixed AEF and SEF from the MEG data of the magnetic field tangential to the scalp and confirmed by comparison with MRI of a subject´s head superimposed source locations
  • Keywords
    SQUID magnetometers; biomedical equipment; magnetic field measurement; magnetoencephalography; vectors; 3-D MEG measurement; 3-D second-order gradiometer; Nb-Ti; Nb-Ti wire; SQUID; auditory evoked field; dipole pattern; multiple sources estimation; rectangular solid; somatosensory evoked field; superimposed source locations; vector measurement; visual inspection; Coils; Inspection; Magnetic field measurement; Magnetic fields; SQUIDs; Scalp; Solids; Time measurement; Wire; Wounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
  • Conference_Location
    Hong Kong
  • ISSN
    1094-687X
  • Print_ISBN
    0-7803-5164-9
  • Type

    conf

  • DOI
    10.1109/IEMBS.1998.747049
  • Filename
    747049