DocumentCode
3337302
Title
Performance of low-mass and high thermal conductivity hybrid for high track density environment
Author
Ikegami, Y. ; Clark, A. ; Ferrere, D. ; Gonzalez-Sevilla, S. ; Hara, K. ; Kohriki, T. ; Terada, S. ; Unno, Y. ; Weber, M.
Author_Institution
High Energy Accel. Res. Organ., KEK, Tsukuba, Japan
fYear
2009
fDate
Oct. 24 2009-Nov. 1 2009
Firstpage
779
Lastpage
781
Abstract
We have fabricated a low-mass and high thermal conductivity hybrid for high track density environment, such as the super LHC experiment. The characteristics of the front-end chip were evaluated with connecting microstrip sensors of different lengths to the ASIC inputs.
Keywords
application specific integrated circuits; microstrip circuits; nuclear electronics; silicon radiation detectors; thermal conductivity; ASIC inputs; application specific integrated circuits inputs; front-end chip; high thermal conductivity hybrid; high track density environment; low-mass conductivity hybrid; microstrip sensors; silicon microstrip detectors; super Large Hadron Collider experiment; Copper; Detectors; Flexible printed circuits; Large Hadron Collider; Microstrip; Sensor phenomena and characterization; Silicon; Strips; Substrates; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Nuclear Science Symposium Conference Record (NSS/MIC), 2009 IEEE
Conference_Location
Orlando, FL
ISSN
1095-7863
Print_ISBN
978-1-4244-3961-4
Electronic_ISBN
1095-7863
Type
conf
DOI
10.1109/NSSMIC.2009.5402271
Filename
5402271
Link To Document