DocumentCode
3337674
Title
[Front cover]
fYear
2010
fDate
23-26 Sept. 2010
Abstract
The following topics are dealt with: assembly and manufacturing technology; electronic circuits; electronics systems and power electronics; microsystems packaging; optoelectronics and advanced communication packaging; applied reliability and thermal management; emerging technologies and trends in advanced packaging; and challenge in global education.
Keywords
assembling; electronics packaging; integrated optoelectronics; manufacturing systems; micromechanical devices; power electronics; advanced communication packaging; advanced packaging; applied reliability; assembly technology; electronic circuit; electronic packaging; electronics system; emerging technology; global education; manufacturing technology; microsystems packaging; optoelectronics; power electronics; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location
Pitesti
Print_ISBN
978-1-4244-8123-1
Type
conf
DOI
10.1109/SIITME.2010.5651710
Filename
5651710
Link To Document