• DocumentCode
    3338482
  • Title

    Measurements of Bi2Te3 nanowire thermal conductivity and Seebeck coefficient

  • Author

    Li, Deyu ; Prieto, Amy Lucia ; Wu, Yiying ; Martin-Gonzalez, Marisol S. ; Stacy, Angelica ; Sands, Timothy ; Gronsky, Ronald ; Yang, Peidong ; Majumdar, Arun

  • Author_Institution
    Dept. of Mech. Eng., California Univ., Berkeley, CA, USA
  • fYear
    2002
  • fDate
    25-29 Aug. 2002
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    Theoretical predictions suggest that the thermoelectric properties of nanowires could be greatly enhanced compared with the bulk materials. To investigate these predictions, bismuth telluride nanowires are synthesized by electrodeposition into the cavities of porous alumina templates. Individual nanowires are then isolated, and subjected to measurements of both thermal conductivity and Seebeck coefficient over temperatures ranging from 20 K to 320 K. All measurements are made using a microfabricated device consisting of two suspended membranes with integrated heaters and resistance thermometers. Platinum or carbon films are locally deposited at the wire and the heater pad junctions to enhance the contact conductance. Results show that the thermal conductivity of the measured Bi2Te3 nanowires varies from wire to wire and show different temperature dependence, probably because the wire composition and crystal structure are not the same.
  • Keywords
    Seebeck effect; bismuth compounds; electrodeposits; nanowires; semiconductor materials; thermal conductivity; 20 to 320 K; Al2O3; Bi2Te3; Bi2Te3 nanowire thermal conductivity; C; Pt; Seebeck coefficient; crystal structure; electrodeposition; temperature dependence; wire composition; Bismuth; Conducting materials; Conductivity measurement; Electrical resistance measurement; Nanowires; Temperature distribution; Thermal conductivity; Thermal resistance; Thermoelectricity; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2002. Proceedings ICT '02. Twenty-First International Conference on
  • Print_ISBN
    0-7803-7683-8
  • Type

    conf

  • DOI
    10.1109/ICT.2002.1190333
  • Filename
    1190333