DocumentCode
3338633
Title
Low temperature Seebeck coefficient measurement: Possible sources of uncertainty and spurious emf
Author
Sivakumar, K.M. ; Singh, R.K. ; Gaur, N.K. ; Shelke, Vilas
Author_Institution
RKDF Inst. of Sci. & Technol., Bhopal, India
fYear
2002
fDate
25-29 Aug. 2002
Firstpage
361
Lastpage
364
Abstract
In the present work we have addressed the possible sources of uncertainty and spurious emf in the low temperature Seebeck coefficient measurement (dc method) from 77 to 300 K in an apparatus based on copper block sandwich type design using a YBCO high temperature superconducting sample. Two identical differential copper-constantan thermocouples were used under different conditions for gradient measurement. Similarly, two identical pairs of signal leads (Copper) were used to measure the signal across the sample. A systematic comparison has been made by comparing the values of gradient and signal measured across the thermocouples and signal leads, which were connected/mounted under different methods and techniques. Besides, measurements were performed under different methods like slow cool down, cool down in an exchange gas atmosphere, natural warm-up, steady state cool down etc and a comparison has been made.
Keywords
Seebeck effect; barium compounds; copper; measurement uncertainty; thermocouples; voltage measurement; yttrium compounds; 77 to 300 K; Cu; Cu block sandwich type design; DC method; YBaCuO; YBaCuO high temperature superconducting sample; differential copper-constantan thermocouples; exchange gas atmosphere; gradient measurement; low temperature Seebeck coefficient measurement; measurement uncertainty; natural warm-up; signal leads; slow cool down; spurious EMF; steady state cool down; Atmosphere; Atmospheric measurements; High temperature superconductors; Isothermal processes; Stability; Steady-state; Temperature distribution; Temperature measurement; Thermal conductivity; Yttrium barium copper oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2002. Proceedings ICT '02. Twenty-First International Conference on
Print_ISBN
0-7803-7683-8
Type
conf
DOI
10.1109/ICT.2002.1190340
Filename
1190340
Link To Document