Title :
CFD for Electronics Cooling: MCAD and EDA embedded vs. stand-alone
Author_Institution :
Mech. Anal. Div., Mentor Graphics Corp., East Molesey
Abstract :
Computational fluid dynamics (CFD) for electronics cooling (EC) has developed differently from general-purpose CFD, due to the nature of the market it serves. The benefits are clear - the use of EC CFD in product design has had a profound impact on both time-to-market and cost.
Keywords :
CAD; computational fluid dynamics; cooling; integrated circuit packaging; CFD; EDA vendors; IC package; MCAD; application-specific codes; computational fluid dynamics; electronics cooling; equipment design; product creation process; stand-alone software; thermal design; Application software; Computational fluid dynamics; Consumer electronics; Electronic design automation and methodology; Electronic packaging thermal management; Electronics cooling; Fluid dynamics; Graphics; Packaging machines; Product design;
Conference_Titel :
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-3365-0
Electronic_ISBN :
978-2-35500-008-9
DOI :
10.1109/THERMINIC.2008.4669869
