• DocumentCode
    3339243
  • Title

    Solder paste printing in six-sigma-quality

  • Author

    Wohlrabe, Heinz

  • Author_Institution
    Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2010
  • fDate
    23-26 Sept. 2010
  • Firstpage
    33
  • Lastpage
    38
  • Abstract
    The solder paste printing is one important part of the manufacturing process. More than 50% of all defects of SMT-boards are caused by the printing process. Six-sigma-quality is one common important goal of manufacturing processes. Another criterions or such a quality are a defect rate of about 3,4 DPM (defects per million) or a process capability Cpk > 1,5. The printed solder paste volume, the printed area; the height and the deviations (x/y) are the most important quality characteristics, to evaluate the printing quality. The paper shows some practical experiments and the associated results, to optimize the printing process.
  • Keywords
    printing; solders; surface mount technology; SMT-boards; manufacturing process; six-sigma-quality; solder paste printing; Apertures; Cleaning; Electronics packaging; Equations; Mathematical model; Printing; Six sigma;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
  • Conference_Location
    Pitesti
  • Print_ISBN
    978-1-4244-8123-1
  • Type

    conf

  • DOI
    10.1109/SIITME.2010.5651807
  • Filename
    5651807