DocumentCode
3339243
Title
Solder paste printing in six-sigma-quality
Author
Wohlrabe, Heinz
Author_Institution
Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany
fYear
2010
fDate
23-26 Sept. 2010
Firstpage
33
Lastpage
38
Abstract
The solder paste printing is one important part of the manufacturing process. More than 50% of all defects of SMT-boards are caused by the printing process. Six-sigma-quality is one common important goal of manufacturing processes. Another criterions or such a quality are a defect rate of about 3,4 DPM (defects per million) or a process capability Cpk > 1,5. The printed solder paste volume, the printed area; the height and the deviations (x/y) are the most important quality characteristics, to evaluate the printing quality. The paper shows some practical experiments and the associated results, to optimize the printing process.
Keywords
printing; solders; surface mount technology; SMT-boards; manufacturing process; six-sigma-quality; solder paste printing; Apertures; Cleaning; Electronics packaging; Equations; Mathematical model; Printing; Six sigma;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location
Pitesti
Print_ISBN
978-1-4244-8123-1
Type
conf
DOI
10.1109/SIITME.2010.5651807
Filename
5651807
Link To Document