DocumentCode
3339731
Title
On the standardisation of thermal characterisation of LEDs Part I: Comparison with IC packages and proposal for action
Author
Lasance, Clemens J M
Author_Institution
Philips Res. Labs., Eindhoven
fYear
2008
fDate
24-26 Sept. 2008
Firstpage
208
Lastpage
212
Abstract
The increasing need for standardisation of thermal characterisation of LEDS and LED-based products. Manufacturers and end-users alike are crying for fair and useful thermal data, but for different reasons. It goes without saying that the LED-business is growing exponentially, in fact, much faster than analysts predicted five years ago. Unfortunately, the progress in thermal characterisation has not kept pace. The situation is becoming a serious problem for leading manufacturers who are focusing on a sustainable business for the future and are willing to publish reliable thermal data. Unfortunately, due to the lack of worldwide accepted standards a manufacturer can publish whatever he wants. It also becomes a problem for the experienced user because the thermal data that are published are often rather useless in practice when accuracy is at stake, and accuracy is needed for an educated guess of expected performance and lifetime. Part I focuses upon what we can learn from history because the situation is not much different from the one the IC-world was facing almost 20 years ago. Part II deals with the objectives of LED thermal characterisation. The authors propose to establish a consortium consisting of manufacturers, end-users, and software and test people, to get the ball rolling.
Keywords
integrated circuit packaging; light emitting diodes; IC packages; LED-based products; ball rolling; leading manufacturers; thermal characterisation standardisation; thermal data; Electrical resistance measurement; Electronic packaging thermal management; Equations; History; Integrated circuit packaging; Light emitting diodes; Manufacturing; Proposals; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Inveatigation of ICs and Systems, 2008. THERMINIC 2008. 14th International Workshop on
Conference_Location
Rome
Print_ISBN
978-1-4244-3365-0
Electronic_ISBN
978-2-35500-008-9
Type
conf
DOI
10.1109/THERMINIC.2008.4669910
Filename
4669910
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