STATPEP-current status of power electronic packaging for power supplies-methodology

Author

Meinhardt, Mike ; Alderman, Arnold ; Flannery, John ; Cheasty, Philip ; Eckert, Sven ; Mathuna, Cian Ó

Author_Institution

Nat. Microelectron. Res. Centre, Cork, Ireland

Volume

1

fYear

1999

fDate

14-18 Mar 1999

Firstpage

16

Abstract

The paper shows the motivation, methodology and early results of a review of the status of power electronic packaging (STATPEP) used in commercial DC/DCand AC/DC-switch mode power supplies. Based on the current status and the knowledge about the development of PEP over the last 5 to 10 years experience curves are developed which show the expected trends in PEP of power supplies for the future. The STATPEP project is being co-sponsored by the PSMA and participating companies

Keywords

AC-DC power convertors; DC-DC power convertors; power electronics; semiconductor device packaging; switched mode power supplies; AC/DC-switch mode power supplies; DC/DC-switch mode power supplies; PSMA; STATPEP; STATPEP project; experience curves; power electronic packaging; power supplies; Consumer electronics; Driver circuits; Electronics industry; Electronics packaging; Manufacturing; Power electronics; Power supplies; Power systems; Switches; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition, 1999. APEC '99. Fourteenth Annual

Conference_Location

Dallas, TX

Print_ISBN

0-7803-5160-6

Type

conf

DOI

10.1109/APEC.1999.749484

Filename

749484