• DocumentCode
    3340934
  • Title

    Inductively Coupled Plasma Atomic Emission Spectroscopy: A bulk analysis and process monitoring technique for silicon solar cell fabrication

  • Author

    Joshi, Amruta P. ; Raval, Mehul C. ; Kottantharayil, Anil ; Solanki, Chetan Singh

  • Author_Institution
    Dept. of Energy Sci. & Eng., Indian Inst. of Technol. Bombay, Mumbai, India
  • fYear
    2013
  • fDate
    16-21 June 2013
  • Abstract
    We report on the investigation of Inductively Coupled Plasma Atomic Emission Spectroscopy (ICP AES), a trace element analysis technique, as a bulk impurity characterization and process monitoring technique in silicon solar cell fabrication. Various impurities may be inherent to the nascent silicon material itself or get introduced during the fabrication process. These may be present at the surface or in the bulk of the silicon wafer and would degrade performance of the solar cells. The distribution of impurities varies throughout the wafer during the solar cell fabrication process. The analysis of the etchant solutions obtained by layer-wise digestion of the solar cell precursor after each step of fabrication using ICP AES elucidates how the distribution of impurities changes during the process. Also monitoring the impurity content in various chemical baths, such as the chemicals used for wafer cleaning, saw damage etching (SDE) or phosphosilicate glass (PSG) removal, after processing batches of wafers offers an insight about performance of chemical processes. Thus it would be a powerful tool for monitoring impurity content in the starting wafers, those introduced during cell processing and hence useful for improving efficiency and yield.
  • Keywords
    atomic emission spectroscopy; elemental semiconductors; etching; impurity distribution; silicon; solar cells; ICP-AES; PSG; SDE; Si; bulk impurity characterization analysis; chemical bath processing; etchant solutions; impurity content monitoring; impurity distribution; inductively coupled plasma atomic emission spectroscopy; layer-wise digestion; phosphosilicate glass removal; process monitoring technique; saw damage etching; silicon solar cell fabrication process; silicon wafer; trace element analysis technique; wafer cleaning; Chemicals; Fabrication; Impurities; Iterative closest point algorithm; Nickel; Photovoltaic cells; Silicon; characterization; depth profiling; emission spectroscopy; fabrication; impurities; silicon solar cell;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th
  • Conference_Location
    Tampa, FL
  • Type

    conf

  • DOI
    10.1109/PVSC.2013.6744201
  • Filename
    6744201