DocumentCode :
3341871
Title :
Determining Thermal Simulation Data from Transient Measurements
Author :
Janicki, Marcin ; Kindermann, Stefan ; Pietrzak, Piotr ; Vermeersch, Bjorn ; Banaszczyk, Jedrzej ; Mey, Gilbert De ; Napieralski, Andrzej
fYear :
2008
fDate :
16-20 March 2008
Firstpage :
198
Lastpage :
201
Abstract :
This paper illustrates how the information obtained from dynamic thermal measurements can be used directly for the determination of certain unknown thermal data necessary for simulation purposes. Experimental heating curves of a hybrid power amplifier are processed further to compute the time constant spectra of the thermal responses and to construct their corresponding structure functions. From these functions, the values of selected thermal model parameters, such as the heat transfer coefficient or the contact resistance are determined. Owing to this approach, it is possible to eliminate certain time consuming parameter optimization procedures.
Keywords :
power amplifiers; temperature measurement; dynamic thermal measurements; heat transfer coefficient; heating curves; hybrid power amplifier; parameter optimization; thermal responses; thermal simulation data; time constant spectra; transient measurements; Computer simulation; Cooling; Electronic packaging thermal management; Heat transfer; Impedance; Power amplifiers; Power system modeling; Resistance heating; Temperature measurement; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4244-2123-7
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2008.4509390
Filename :
4509390
Link To Document :
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