• DocumentCode
    3341871
  • Title

    Determining Thermal Simulation Data from Transient Measurements

  • Author

    Janicki, Marcin ; Kindermann, Stefan ; Pietrzak, Piotr ; Vermeersch, Bjorn ; Banaszczyk, Jedrzej ; Mey, Gilbert De ; Napieralski, Andrzej

  • fYear
    2008
  • fDate
    16-20 March 2008
  • Firstpage
    198
  • Lastpage
    201
  • Abstract
    This paper illustrates how the information obtained from dynamic thermal measurements can be used directly for the determination of certain unknown thermal data necessary for simulation purposes. Experimental heating curves of a hybrid power amplifier are processed further to compute the time constant spectra of the thermal responses and to construct their corresponding structure functions. From these functions, the values of selected thermal model parameters, such as the heat transfer coefficient or the contact resistance are determined. Owing to this approach, it is possible to eliminate certain time consuming parameter optimization procedures.
  • Keywords
    power amplifiers; temperature measurement; dynamic thermal measurements; heat transfer coefficient; heating curves; hybrid power amplifier; parameter optimization; thermal responses; thermal simulation data; time constant spectra; transient measurements; Computer simulation; Cooling; Electronic packaging thermal management; Heat transfer; Impedance; Power amplifiers; Power system modeling; Resistance heating; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-2123-7
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2008.4509390
  • Filename
    4509390