DocumentCode
3341871
Title
Determining Thermal Simulation Data from Transient Measurements
Author
Janicki, Marcin ; Kindermann, Stefan ; Pietrzak, Piotr ; Vermeersch, Bjorn ; Banaszczyk, Jedrzej ; Mey, Gilbert De ; Napieralski, Andrzej
fYear
2008
fDate
16-20 March 2008
Firstpage
198
Lastpage
201
Abstract
This paper illustrates how the information obtained from dynamic thermal measurements can be used directly for the determination of certain unknown thermal data necessary for simulation purposes. Experimental heating curves of a hybrid power amplifier are processed further to compute the time constant spectra of the thermal responses and to construct their corresponding structure functions. From these functions, the values of selected thermal model parameters, such as the heat transfer coefficient or the contact resistance are determined. Owing to this approach, it is possible to eliminate certain time consuming parameter optimization procedures.
Keywords
power amplifiers; temperature measurement; dynamic thermal measurements; heat transfer coefficient; heating curves; hybrid power amplifier; parameter optimization; thermal responses; thermal simulation data; time constant spectra; transient measurements; Computer simulation; Cooling; Electronic packaging thermal management; Heat transfer; Impedance; Power amplifiers; Power system modeling; Resistance heating; Temperature measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-2123-7
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2008.4509390
Filename
4509390
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