• DocumentCode
    3342640
  • Title

    Performance evaluation of top contact PANI organic thin film transistors with SiO2 and poly(methyl methacrylate) as gate dielectrics

  • Author

    Parameshwara, S. ; Renukappa, N.M.

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Nat. Inst. of Eng., Mysore, India
  • fYear
    2013
  • fDate
    June 30 2013-July 4 2013
  • Firstpage
    568
  • Lastpage
    571
  • Abstract
    Organic thin film transistors (OTFTs) were fabricated using polyaniline (PANI) of 3wt.% concentration, as the active layer with two different gate dielectrics, namely silicon dioxide (SiO2) and poly(methyl methacrylate) (PMMA), in top contact geometry for comparative studies. To deal with poor stability and large leakage currents between source/drain and gate electrodes, isolated OTFTs with reduced source/drain contact area were fabricated by selective deposition of PANI on SiO2 through shadow mask. The effects of the PMMA thickness on the performance of OTFTs has been investigated. The results analysis of the PMMA-based OTFTs exhibited encouraging performance because of their good dielectric characteristics as compared to SiO2.
  • Keywords
    dielectric materials; leakage currents; organic field effect transistors; polymers; silicon compounds; thin film transistors; OTFT; PMMA thickness effect; SiO2; dielectric characteristics; gate dielectrics; gate electrodes; leakage currents; performance evaluation; poly(methyl methacrylate); polyaniline; source-drain contact area; source-drain electrodes; top contact PANI organic thin film transistors; top contact geometry; Dielectric constant; Logic gates; Organic thin film transistors; Plastics; Threshold voltage; Organic thin film transistors; Polyaniline; isolated OTFTs; poly(methyl methacrylate); top contact;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid Dielectrics (ICSD), 2013 IEEE International Conference on
  • Conference_Location
    Bologna
  • ISSN
    2159-1687
  • Print_ISBN
    978-1-4799-0807-3
  • Type

    conf

  • DOI
    10.1109/ICSD.2013.6619808
  • Filename
    6619808