DocumentCode
3345154
Title
Performance Measurement of an Integrated NIC Architecture with 10GbE
Author
Liao, Guangdeng ; Bhuyan, Laxmi
Author_Institution
Dept. of Comput. Sci. & Eng., Univ. of California, Riverside, Riverside, CA, USA
fYear
2009
fDate
25-27 Aug. 2009
Firstpage
52
Lastpage
59
Abstract
The deployment of 10 Gigabit Ethernet (10 GbE) connections to servers has been hampered by the "fast-network-slow-host" phenomenon. Recently, the integration of network interfaces (INICs) is proposed to tackle the performance mismatch. While significant advantages over PCI-based discrete NICs (DNICs) were shown in prior work using simulation methodologies, it is still unclear how INICs perform on real machines with 10 GbE. This paper is the first to study the impact of INICs by extensive evaluations through micro-benchmarks on a highly threaded Sun Niagara 2 processor. The processor is the industrypsilas first "system on a chip," integrating two 10 GbE NICs. We observe that the INIC only shows its advantage over the DNIC with large I/O sizes. It improves 7.5% network bandwidth while saving 20% relative CPU utilization. We characterize the system behaviors to fully understand the performance benefits with respect to different number of connections, OS overhead, instruction counts, and cache misses etc. All of our studies reveal that there is a benefit of integrating NICs onto CPUs, but the gain is somewhat marginal. More aggressive integrated NIC designs should be adopted for higher speed networks like the upcoming 40 GbE and 100 GbE.
Keywords
local area networks; performance evaluation; peripheral interfaces; 10 Gigabit Ethernet; Sun Niagara 2 processor; integrated NIC architecture; network interfaces; performance measurement; Bandwidth; Computer architecture; Computer science; Delay; Ethernet networks; Measurement; Network servers; Registers; Sun; USA Councils; 10GbE; Characterization; Discrete NIC; Integrated NIC; Performace Evaluation; Sun Niagara 2;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Interconnects, 2009. HOTI 2009. 17th IEEE Symposium on
Conference_Location
New York, NY
ISSN
1550-4794
Print_ISBN
978-0-7695-3847-1
Electronic_ISBN
1550-4794
Type
conf
DOI
10.1109/HOTI.2009.16
Filename
5238684
Link To Document